This paper presents a design framework for soft-error-resilient sequential cells, by introducing a new sequential cell called LEAP-DICE and evaluating it against existing circuit techniques in the “soft error resilience-power-delay-area” design space in an 180 nm CMOS test chip. LEAP-DICE, which employs both circuit and layout techniques, achieved the best soft error performance with a 2,000X improvement over the reference D flip-flop with moderate design costs. This study also discovered new soft error effects related to operating conditions.
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Lee et al. (2011) studied this question.
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