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August 14, 2012ECS Solid State Letters

Improved Thermal Stability and Electrical Performance by Using PEALD Ultrathin Al2O3 Film with Ta as Cu Diffusion Barrier on Low k Dielectrics

Qi Xie Fei Chen Shaoren Deng Davy Deduytsche Christophe Detavernier X.-P. Qu

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Abstract

Improved Thermal Stability and Electrical Performance by Using PEALD Ultrathin Al2O3 Film with Ta as Cu Diffusion Barrier on Low k Dielectrics, Ding, Shao-Feng, Xie, Qi, Chen, Fei, Lu, Hai-Sheng, Deng, Shao-Ren, Deduytsche, David, Detavernier, Christophe, Qu, Xin-Ping

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Xie et al. (2012) studied this question.

synapsesocial.com/papers/6ad502fe9c077173bb469f9c https://doi.org/10.1149/2.006203ssl

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