Answers are grounded in this paper and cite their sources.
The temperature dependence of the trap-assisted tunneling (TAT) current component in Ge p+n junctions has been studied between 25degC and 140degC. It is shown that the impact of TAT reduces significantly due to the combination of the negative thermal activation of the TAT-enhancement factor and the exponential increase of the diffusion current with temperature. It is shown that the experimental data can be well described in the frame of the Hurkx analytical model, which allows a fairly easy assessment of the TAT current contribution to the junction leakage current at realistic operation temperatures of Ge CMOS circuits.
No takes yet. Share an insight, caveat, or question.
Simoen et al. (2009) studied this question.
Synapse has enriched 10 related papers. Consider them for comparative context: