Wavon Field-Based Generalized In-Memory Computing Chip Architecture

What if a chip could be wired by field instead of lithography? The Wavon architecture answers with a single structural proposition: computation need not be carried by wired electrons at all. It replaces fixed interconnect with a blank topological lattice, in which 20-80 GHz millimetre-band electromagnetic evanescent waves act as the signal carrier, and solid-state magnetic skyrmions hold the state of the machine. Nothing in the substrate is hardwired. PDMM software instructions rewrite the steady-state MTJ magnetoresistance, configuring waveguide routing and model weights online, while the physical eigenstructure of the field does the arithmetic: discrete topological boundaries compress the O(n²) cost of conventional matrix multiply-accumulate into a constant O(1) latency intrinsic to MEPS wavefront evolution. The chip leaves the fab as a uniform blank lattice on a 28 nm ultra-near-field substrate, built by a three-layer ultraviolet nanoimprint co-integration process. Vernier Moiré fringes formed by lattice arrays and passive metallic meshes deliver physical self-alignment between layers, removing the multilayer precision overlay lithography and heavy ion doping that conventional silicon requires, and removing any dependence on high-numerical-aperture front-end lithography across the full operational cycle. Interleaved coplanar MTJ and skyrmion arrangements form a globally vacuum-sealed microcavity tunnelling waveguide system that fixes the local guided-mode refractive index at unity with dn/dT = 0. Rare-earth-free, heavy-metal-free RE-TM heterostructures anchor the skyrmions with zero drift at room temperature. Two modes share one hardware origin: binary wavefront carry arithmetic for absolute-precision digital inference, and continuous field-state evolution for energy-level excitation of topological states. The full fabrication process adapts to mature mass-production semiconductor lines without specialised new equipment.