Siliconware Precision Industries (Taiwan)

Recent papers from Siliconware Precision Industries (Taiwan)

1. Cleaning Challenge of Die Attach Process in FCBGA with Larger Die Sizes and Finer Bump PitchesIMAPSource Proceedings · 2025
2. Thermal Performance of High Thermal Conductivity TIM for Large Advanced Package through TTV Measurement and FEM Analysis ApproachIMAPSource Proceedings · 2025
3. High Density Integration of Silicon Photonic Chiplets for 51.2T Co-packaged Optics2024
4. Ultra Thin Fan-Out 3D WLCSP Heterogeneous Integration Packaging2024
5. Underfill Selection Guideline for Fan-Out Heterogeneous Integration Package2024
6. Fan-Out Embedded Bridge Structure for CoPackaged Optics Characterization and Evaluation2024
7. High Speed Signal Design on Fan-Out RDL Interposer for Artificial Intelligence (AI) and Deep Neural Network (DNN) Chiplet Accelerators Application2024
8. Advanced TIM Material Analysis for High Performance Package Applications2024
9. Investigation of Blind MicroVias Bonding Force: A Field Study2024
10. High Performance 3D Heterogeneous Integration Package2024
11. Study of Galvanic Effect Factor and Mechanism for Ni/Au Plated Substrate2024
12. The Compliance Risk Assessment of EU REACH SVHC in Articles of IC Package by Studies of Analysis MethodologyIMAPSource Proceedings · 2024
13. Design and Implementation of High-Efficiency and Compact Fuel Cell–Battery Hybrid Power SystemProcesses · 2024
14. Tree-Based Machine Learning Models with Optuna in Predicting Impedance Values for Circuit AnalysisSHILAP Revista de lepidopterología · 2023
15. RLC Circuit Forecast in Analog IC Packaging and Testing by Machine Learning TechniquesMicromachines · 2022
16. High Thermal Assembly Solution for Large FOEB Chiplets Integrated Package in HPC Application2022
17. High Reliability Solution of 2.5D Package Technologies2021
18. Compensation of Voltage Sags and Swells Using Dynamic Voltage Restorer Based on Bi-Directional H-Bridge AC/AC ConverterProcesses · 2021
19. 38-GHz Phased Array Transmitter and Receiver Based on Scalable Phased Array Modules With Endfire Antenna Arrays for 5G MMW Data LinksIEEE Transactions on Microwave Theory and Techniques · 2020
20. Multi-Objective Production Programming to Systematic Sorting and Remanufacturing in Second-Hand Clothing Recycling IndustrySymmetry · 2020