Custom Computer-Aided Design Methodologies for Cross-Domain Failure Analysis in Advanced System-in-Package Architectures

This article presents custom CAD methodologies designed to support efficient failure analysis across disaggregated domains in advanced heterogeneous packages. By enabling synchronized navigation, cross-domain correlation, and real-time visualization across multiple databases, these tools help overcome IP silos and format fragmentation. The result is a significant improvement in traceability, diagnostic precision, and overall failure analysis throughput—driving higher yield and reliability in next-generation semiconductor systems.