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A new MOS dynamic random access memory (dRAM) cell named "CCC" has been successfully developed based on a one-device cell concept. This CCC is characterized by an etched-moat storage-capacitor extended into the substrate, resulting in almost independent increase in storage capacitance CSof its cell size. A typical CSvalue of 60 fF has been obtained with 3 × 7 µm2CCC having a 4-µm deep moat and a capacitor insulator equivalent to 15 nm SiO2in thickness. The CCC is discussed in terms of its capacitance characteristics, dRAM operation with unit 32-Kbit array, some limiting factor to its closer packing, and future considerations.
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Sunami et al. (1984) studied this question.
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