Answers are grounded in this paper and cite their sources.
Two experiments have been performed to investigate the role that the intermetallic reaction between the copper matrix and the Nb-Ti filaments plays in limiting the critical current density (Jc) of Nb 46.5 wt% Ti composites. The first experiment involved composites which were industrially extruded. It was found that as the number of heat treatments increased, the Jcdeclined, the resistive transition broadened and the filaments sausaged. The filament sausaging was initiated by intermetallic particles at the filament matrix interface. A series of many heat treatment procedures were then applied to composites fabricated in our own laboratories without extrusion. Very high Jcvalues were obtained at filament sizes of 20 μm. When the same heat treatment procedures were applied to 4 - 5 μm conductors, extensive sausaging and degraded Jcvalues resulted. This degradation was also found to be due to the formation of Cu-Nb-Ti intermetallic compounds. It is concluded that a reliable filament diffusion barrier technology is necessary to permit full flexibility in the heat treatment of 2 - 5 μm filament Nb-Ti composites.
No takes yet. Share an insight, caveat, or question.
Larbalestier et al. (1985) studied this question.
Synapse has enriched 10 related papers. Consider them for comparative context: