SummaryPolystyrene is selected as a suitable substrate material for investigating chemical adhesion to electroless copper plating. The choice of surface geometry is discussed. Peel adhesion results are shown for natural, carboxylic and nitro-derived surfaces. Finally it is shown that there exists a difference in the ability of surface groups to provide chemical interaction with the copper plating.
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A. Rantell (1969) studied this question.
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