The Effect of Metallic Contamination on the Structure and Ductility of Electrodeposited Nickel

SummaryTransmission electron microscopy has been used to investigate the structure of nickel electrodeposits plated from solutions containing copper and zinc as contaminants. Ductility of deposits was determined and subsequently deformed deposits were examined by transmission electron microscopy. An addition of copper or zinc (within concentration range 0–0.134 g/1 metal ion) to the dull Watts nickel solution did not result in significant changes in microstructure or ductility at 40 A/ft2, 135°F and pH 4. Additions of copper or zinc to a semi-bright nickel solution (Watts +0·1 g/1 coumarin) resulted in a small grain size and a moderate reduction in ductility. The dislocation density in deformed deposits was increased and strain fields formed at twin boundaries.