What question did this study set out to answer?

To determine how microstructure and crystallographic orientation in copper thin films influence material removal rates and surface topography during focused-ion-beam micromachining.

July 1, 2000Journal of Vacuum Science & Technology A Vacuum Surfaces and Films

Channeling effects during focused-ion-beam micromachining of copper

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Authors

JPJ. R. PhillipsCardinal Health (United States)DGD. P. GriffisNorth Carolina State University PRP. E. RussellWest Virginia University

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Implication

Experimental study demonstrates channeling-driven material removal rate enhancements in textured copper films, highlighting microstructure-dependent variability during focused-ion-beam micromachining.

Key Points

To determine how microstructure and crystallographic orientation in copper thin films influence material removal rates and surface topography during focused-ion-beam micromachining.
Evaluated Ga+ focused-ion-beam micromachining across thin copper films synthesized via physical-vapor deposition (PVD) and electroplating (EP), alongside single-crystal (111) copper controls.
Measured material removal rates and monitored topographical changes under varying sample tilt angles, including 12° relative to the incident ion beam, across 360° rotational orientations.
PVD copper films exhibited <111> columnar grain texture, generating a 30% geometric enhancement in material removal rate at a 12° tilt angle regardless of sample rotation.
Single-crystal (111) copper samples demonstrated an equivalent material removal rate enhancement at a 12° tilt across 360° rotation, confirming texture-driven channeling as the primary mechanism.
Electroplated copper films with randomly oriented grains showed no tilt-dependent removal rate enhancement beyond expected cosine dependence, instead developing severe surface roughness from preferential grain etching.

Cite This Study

Phillips et al. (2000) studied this question.

synapsesocial.com/papers/6aacd2aaa37e8eb65f20f3cd https://doi.org/10.1116/1.582300

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Channeling effects during focused-ion-beam micromachining of copper

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Key Points

Cite This Study

Channeling effects during focused-ion-beam micromachining of copper

Discussion

Member takes

Implication

Key Points

Cite This Study

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