The article deals with the problems of failures of IC caused by the effects of charge propagation and the formation of parasitic channels and their prevention at the initial stages of design fabrication. The issues related to these refusals are considered, summarized and systematized. The article presents some practical examples that take into account modern methods and techniques of designing and manufacturing IC, which can be used to improve their reliability.
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Vladimir V. Shubin (2024) studied this question.
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