Bias values, determined experimentally to result in single-event gate rupture (SEGR) in power metal oxide semiconductor field effect transistors (MOSFETs), are used in 2-D device simulations, incorporating the experimental geometry. The simulations indicate that very short time oxide field transients occur for ion strikes when V/sub DS//spl ne/OV. These transients can affect SEGR through hole trapping and redistribution in the oxide.>
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Allenspach et al. (1994) studied this question.
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