Influence of process parameters on the substrate heating in direct current plasma magnetron sputtering deposition process

This is the authors' abstract. We don't add key points for this paper.

Purpose The purpose of this paper is to address the influence of deposition process parameters. The substrate heating mechanisms are also discussed. Design/methodology/approach Deposition duration, sputtering power, working gas pressure, and substrate heater temperature on substrate heating in the direct current (DC) magnetron sputtering deposition process were investigated. Findings Results from the experiments show that, in DC magnetron sputtering deposition process, substrate heating is largely influenced by the process parameters and conditions. Originality/value This paper usefully demonstrates that substrate heating effects can be minimized by adjusting and selecting the proper sputtering process parameters; the production cost can be reduced by employing a higher sputtering power, lower working gas pressure and shorter deposition duration.