Answers are grounded in this paper and cite their sources.
The performance of Nonvolatile phase-change-memory material Ge2Sb2Te5 and nitrogen doped Ge2Sb2Te5 as well as its device cell was investigated. The effects of the annealing temperature on the resistivity and crystal structure of the Ge2Sb2Te5 were studied. The Hall measurement shows the hole mobility decreased with the changing of film thickness from 10 nm. to 100 nm The GST resistivity can be increased effectively by doping nitrogen and the decrease of the film thickness. The high resistive GST is indispensable to minimize threshold voltage of PCRAM.
No takes yet. Share an insight, caveat, or question.
Ling et al. (2006) studied this question.
Synapse has enriched 10 related papers. Consider them for comparative context: