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October 10, 2025Open Access

3D Electronic-Photonic Heterogenous Interconnect Platforms Enabling Energy-Efficient Scalable Architectures For Future HPC Systems

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Authors

ASAnirban SamantaUniversity of California, DavisSLS. G. LeeCCChung‐Ping ChengThe University of Sydney

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Implication

Proposed 3D EPIC platform improves bandwidth density over traditional 3D electrical interconnects, suggesting significant energy efficiency.

Key Points

  • The 3D EPIC platform achieves over 10 TB/s/mm2 bandwidth density, surpassing conventional electrical interconnects.
  • Using Through Silicon Optical Vias enables high-speed optical communication, addressing existing signal quality issues.
  • Designed for high-performance computing, this technology retains power delivery functions while enhancing communication efficiency.
  • The platform demonstrates potential for energy-efficient solutions in future scalable architectures.

Cite This Study

Samanta et al. (2025) studied this question.

synapsesocial.com/papers/68e8ed7aa1d181ff1b948112https://doi.org/10.48550/arxiv.2510.03943
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